ALD Applications

Conquering thin-film challenges across complex 3D geometries and the nanoscale is where ALDO begins. From lab-scale proof-of-concept to G6-generation production, we let real process data do the talking.

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Core Advantages of ALD Technology

Overcoming the physical bottlenecks of 3D geometry —redefining thin-film deposition.

When structures become deep, narrow, or three-dimensional, thin-film deposition runs into physical limits around conformality and bottom-of-hole coverage.ALDO starts from surface chemistry mechanisms to offer process solutions that overcome these limits.

ALDO grows films through sequential, self-limiting surface chemistry, achieving excellent conformal coverage even under high aspect ratios and complex geometries, while enabling Ångström-level thickness precision。

Not sure if ALD fits your application? That's exactly what a PoC evaluation is for.

Display Technology | Micro LED / Silicon Photonics / OLED

Breaking through low-temperature encapsulation bottlenecks with superior WVTR moisture/oxygen barrier and micron-scale sidewall passivation.

#Micro LED Sidewall Passivation #OLED Moisture/Oxygen Barrier #WVTR #Low-Temperature Encapsulation #Silicon Photonic Waveguides

Critical Pain Points

  • Heat & Moisture/Oxygen Degradation: Quantum dot (QD) and OLED materials are extremely heat-sensitive and prone to moisture/oxygen degradation — conventional high-temperature processes directly damage material activity and luminous lifetime
  • Large-Area Uniformity & Scale-Up Bottleneck: Scaling the process up to large display substrates makes thickness control highly vulnerable to gas-flow non-uniformity

The ALD Solution

  • <100°C Ultra-Low-Temperature Process: Properly protects delicate materials like QD and OLED, reducing thermal degradation caused by high temperatures
  • G4.5 to G6 Generation Line Production Technology: Film non-uniformity <3%, meeting the demands of large-substrate mass production

Semiconductor | Advanced 3D Packaging (FOPLP / TGV / TSV)

Designed for high-aspect-ratio (HAR) structures, effectively overcoming process challenges in TGV/TSV vias and High-k dielectric layers.

#Advanced Packaging Insulation Layer #High-Aspect-Ratio Coating #FOPLP Panel-Level Packaging #TSV (Through-Silicon Via) #TGV (Through-Glass Via) #High-k Dielectric Layer

Critical Pain Points

  • High-Aspect-Ratio Coating Limits: TSV and TGV aspect ratios keep hitting new highs, and conventional coating methods struggle to reach the bottom of the via
  • High-Voltage Leakage Failure Risk: Incomplete insulation coverage at the bottom of the via leads to leakage failure under high-frequency, high-voltage operation

The ALD Solution

  • Extremely High Step Coverage: Gas-phase precursors conform highly to complex topographies, achieving excellent uniform conformal deposition deep inside the via
  • Nanoscale Dense Insulation Barrier: Uniformly deposits dense insulation layers (SiO₂, Al₂O₃) or diffusion barriers (TiN) on via walls and bottoms, preventing high-voltage leakage

Optical Coating | Optical Coating

Precisely tuning high- and low-refractive-index materials to achieve low-RMS, high-quality films for AR waveguides and DBR mirrors.

#AR Optical Waveguides #High/Low Refractive-Index Materials #Low Surface Roughness (RMS) #Anti-Reflective (AR) Coating #DBR Mirrors

Critical Pain Points

  • Extremely Low Refractive-Index Tolerance: AR/VR waveguide plates are extremely sensitive to refractive index — even slight thickness deviation causes severe color shift and optical distortion
  • Surface Roughness-Induced Scattering: Conventional sputtering struggles to achieve sub-nanometer thickness precision; rough films cause severe optical scattering, and internal stress further leads to substrate warping

The ALD Solution

  • Atomic-Level (Å) Thickness Precision: Precisely alternates stacking of TiO₂ (high index) and SiO₂ (low index) multilayer films, dramatically reducing refractive-index and color-shift error
  • Ultra-Low Stress & Ultra-Smooth Surface: Surface roughness is stably controlled at RMS < 1nm, eliminating internal stress and avoiding substrate warping for a zero-halo experience

Green Energy | Lithium Batteries & Solar Cells

Mastering powder ALD and surface passivation to build high-reliability solid-state battery SEI films and low-temperature coatings.

#Solid-State Battery SEI Film #Powder ALD #Perovskite Solar ETL #SnO₂ Low-Temperature Coating #Surface Passivation

Critical Pain Points

  • Extremely Poor Environmental Tolerance: Perovskite cells are extremely heat-sensitive and moisture-prone, with short environmental lifespan, making it hard to reliably cross the commercialization threshold
  • Powder & Porous-Coating Blind Spots: Conventional coating cannot uniformly cover powders or porous electrodes — it only coats the surface and cannot penetrate nanoscale pores to provide 3D protection

The ALD Solution

  • Low-Temperature, High-Quality SnO₂ Deposition: Deposits a highly dense, low-resistance electron transport layer (ETL) in an ultra-low-temperature environment that won't damage heat-sensitive materials like perovskite, greatly improving environmental tolerance
  • 3D Powder/Porous Coating Technology: Conforms tightly to anode/cathode powders and porous electrodes, applying a nanoscale solid electrolyte interphase (SEI) film to extend battery cycle life without increasing internal resistance

Biomedical | Biomedical

Fully conforming to porous microstructures, providing titanium alloy surface modification and highly biocompatible anti-corrosion coatings that meet medical application standards.

#Corrosion Protection for Implantable Devices #Biocompatible Coating #Titanium Alloy Surface Modification #Porous Microstructure Coating

Critical Pain Points

  • Difficult Penetration of Complex Structures: Implantable devices like artificial joints and pacemakers often have biomimetic porous structures that conventional line-of-sight coating methods struggle to penetrate deeply
  • Micron-Scale Pores Trigger Bodily-Fluid Corrosion: Even a single micron-scale pore in a conventional coating lets bodily fluid seep in, causing metal corrosion and releasing harmful ions that trigger rejection and failure

The ALD Solution

  • Superior Conformal Coating Capability: Leveraging the diffusion properties of gas-phase precursors, the process highly conforms to and deeply penetrates complex bone-mimicking porous microstructures, achieving extremely uniform film deposition
  • Pinhole-Free Bodily-Fluid Corrosion Barrier: Grows an extremely dense Al₂O₃ or TiO₂ film that completely blocks metal corrosion from bodily-fluid ingress, providing excellent biocompatibility

Precision Coating | Precision Coating

Focused on coating complex 3D geometries, delivering highly conformal anti-static nano-coatings for MEMS packaging and miniature sensors.

#MEMS Packaging #MEMS Anti-Static #Sensor Nano-Coating #Complex 3D Geometry Coating

Critical Pain Points

  • Overly Thick Coating Jams Mechanisms: The minuscule cantilevers and mechanical structures inside MEMS cannot tolerate thick coatings — an overly thick coating directly jams micro-mechanical operation
  • Physical Dimension Changes Cause Inaccuracy: An overly thick coating alters the sensor's original physical dimensions, severely affecting high-frequency oscillation and accuracy; tiny components are also highly susceptible to moisture and static interference

The ALD Solution

  • Ultra-Thin Conformal Coating: Film thickness is precisely controlled to just a few nanometers, leaving the physical dimensions, oscillation frequency, and dynamic behavior of tiny mechanical components completely unchanged
  • All-Around Environmental Insulation Protection: Conforms uniformly to tiny cantilevers and complex 3D geometries, providing exceptional insulation, moisture resistance, and anti-static protection

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