Mass Production EquipmentMass Production ALD Systems
Industrial-grade, modular architecture for ALD mass-production solutions.
Whether for standard wafer production or ultra-large-area substrates, we tailor to your substrate material, line speed, and film-thickness requirements,with optimized, custom-designed reaction chambers and precursor delivery systems.
Core Technical Specifications & Process Capability
Substrate Support & Size Range
WafersFull support for 2", 4", 6", 8" up to 12" wafers.
Large-Area PanelsSupports coating from small square panels to ultra-large-area substrates.
Substrate CompatibilityCompatible with silicon wafers, glass, third-generation compound materials (GaN/SiC), flexible substrates, and a wide range of industrial part surfaces.
Depositable Film Materials & Applications
Dielectric LayersHigh-k dielectric materials, such as Al2O3, HfO2, ZrO2 and others.
Oxide LayersSuch as ZnO, TiO2, In2O3 and other functional metal oxides.
Conductive & Barrier LayersSuch as TiN, AlN, TaN, and other highly conductive or metal-nitride films.
Industrial System Advantages
High-Throughput Architecture
Supports both batch and continuous mass-production architectures, meeting high-speed production-line demands.
Outstanding Uniformity & Film Coverage
Even at ultra-large-area deposition, maintains excellent film-thickness uniformity (< ±1–2%) and superior conformal coverage on high-aspect-ratio 3D structures.